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This chapter will focus on the research development of microelectronic packaging materials, the structure and properties of optoelectronic packaging materials, packaging materials for LED and OLED devices, and optically transparent pressure-sensitive adhesives for displays are introduced.

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Study on the Structure and Properties of Microelectronic Packaging Materials

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  • 发表日期：

    2026年

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  • Gang Wang,
  • Yingfeng Yu

摘要

This chapter will focus on the research development of microelectronic packaging materials, the structure and properties of optoelectronic packaging materials, packaging materials for LED and OLED devices, and optically transparent pressure-sensitive adhesives for displays are introduced.