The integrated circuit is light in weight and low in cost, and it is an inevitable trend to choose a wide range of key equipment. However, due to its non-airtight seal material structure, how to reliably apply the plastic sealed microcircuit is particularly critical. In this paper, the packaging and failure mechanism are introduced, and the corresponding countermeasures are briefly analyzed, and the reliability application requirements of plastic sealed microcircuits are put forward, and the future development suggestions and prospects are given. It can be used as a reference for component manufacturers, standard research units and application research units, and can provide help for the reliability of circuit design, avoid component failure, and guide the reliability application of electronic components.

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Integrated Circuit Application Failure and Countermeasures

  • Shaoyong Chen,
  • Ruo-lin Ruan,
  • Yajuan Li,
  • Chenxi Wang,
  • Kui Xu

摘要

The integrated circuit is light in weight and low in cost, and it is an inevitable trend to choose a wide range of key equipment. However, due to its non-airtight seal material structure, how to reliably apply the plastic sealed microcircuit is particularly critical. In this paper, the packaging and failure mechanism are introduced, and the corresponding countermeasures are briefly analyzed, and the reliability application requirements of plastic sealed microcircuits are put forward, and the future development suggestions and prospects are given. It can be used as a reference for component manufacturers, standard research units and application research units, and can provide help for the reliability of circuit design, avoid component failure, and guide the reliability application of electronic components.