Numerical Simulation of the Effect of Thermal Paste as an Encapsulant Layer a Water-Cooled Photovoltaics
摘要
PV installations in Indonesia are viable solutions to generate solar that is harmless to the environment. However, in equatorial zone, the average temperature on sunny days ranges between 34 to 40 °C, which leads PV panels to overheat, thereby reducing their efficiency and performance. Various methods for cooling have been implemented, but the resulting temperatures have not yet attained optimal levels due to the inefficiency of cold conducting materials. In this study, a novelty of redesigned water-cooled panel with thermal paste as a modified encapsulant (EVA layer) to improve heat transfer distribution and cooling performance efficiency. A numerical simulation is performed to model the fluid flow in the baseplate and analyze the thermal paste's heat transfer as a modification of encapsulant. Furthermore, the result of the final PV cell increased electricity production performance by between 8 and 10% was reported.