We present a methodology that helps reduce the impact of Self-Aligned Quadruple Patterning (SAQP) related process variations on the performance of the custom analog design. The methodology uses the systematic nature of process variation associated with the SAQP manufacturing process. We introduce the concept of indexing the fin grids such that the fin grid with the same index will see the correlated process variations. We also propose a framework to capture the designer’s intent of making matched devices in the layout. The proposed methodology ensures that the matched devices are placed on the fin grids with correlated process variation. We experimented with this methodology on real designs having differential amplifiers and found a significant reduction in the amplifier’s performance variation.