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A heatsink is crucial in electronic devices, tasked with dissipating generated heat during operation. This study compares a novel corrugated airfoil heatsink to a traditional pin fin model for heat dissipation in electronic de-vices. Using AlSi10Mg alloy and LPBF 3D printing, heatsinks were tested at velocities from 2.5 to 8.5 m/s. Results reveal a significant reduction in base plate temperature, with the corrugated airfoil design showing up to 5.4% improvement over the conventional pin fin model. These findings highlight the potential of innovative heatsink designs to enhance cooling efficiency in electronics.

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Enhancement of Heat Sink Performance in Compact Electronic Devices Through Geometry Modification

  • 会议论文

  • 发表日期：

    2026年

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  • S. Aswin,
  • S. Amegh,
  • S. Nair Alok,
  • A. K. Yadhukrishnan,
  • S. R. Suresh Lal

摘要

A heatsink is crucial in electronic devices, tasked with dissipating generated heat during operation. This study compares a novel corrugated airfoil heatsink to a traditional pin fin model for heat dissipation in electronic de-vices. Using AlSi10Mg alloy and LPBF 3D printing, heatsinks were tested at velocities from 2.5 to 8.5 m/s. Results reveal a significant reduction in base plate temperature, with the corrugated airfoil design showing up to 5.4% improvement over the conventional pin fin model. These findings highlight the potential of innovative heatsink designs to enhance cooling efficiency in electronics.