Effective thermal management of 3D TSV chips is a critical factor for the reliable functioning of electronic equipment. This study explores the thermal management of 3D through-silicon via (TSV) chips using novel cooling methods, including heat spreading materials such as graphene-based heat spreader (GBS) and thermally conductive adhesives (TCA), coupled with microchannel heat sink (MCHS). Numerical analysis has been conducted to evaluate thermal performance of various configurations using COMSOL Multiphysics software. The study evaluates temperature profiles and distributions over the chip’s surface to determine the efficacy of the proposed cooling solutions. Temperature profiles have been computed as a function of various key parameters, including the size of TCA underfill, graphene film dimensions, and graphene thermal conductivity. The results demonstrate a significant reduction of 6.1% in the temperature of the hotspots when using GBS and TCA compared to the bare chip configuration. When GBS and TCA are combined with MCHS, a cumulative temperature reduction of 28.71% is attained with respect to the bare chip model, demonstrating the synergistic effects of combining heat-spreading materials with microchannel cooling techniques.