This research presents a novel approach to automating the disassembly process of personal computers (PCs) as a critical step toward circular manufacturing of Waste Electrical and Electronic Equipment (WEEE). By integrating artificial intelligence (AI) and robotics, we aim to optimize resource recovery and minimize environmental impact. The study focuses on developing a system that accurately identifies and localizes key PC components, such as motherboards, processors, cooling fans, and screws, using modern computer vision techniques. YOLO object detection algorithm is employed for 2D image analysis, while morphological computer vision is utilized to transform 2D coordinates into 3D locations. A collaborative robot is then tasked with unmounting the identified components based on the generated 3D locations. This research contributes to the Horizon Europe’s Circular TwAIn project by demonstrating the potential of AI and robotics to revolutionize WEEE management and promote a more sustainable electronic waste lifecycle in Europe.

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Computer Component Disassembly Using AI-Based Object Detection and Collaborative Industrial Robot for Circular Management of WEEE

  • Shaon Sutradhar,
  • Afra María Pertusa Llopis,
  • Daniel Gordo Martín,
  • Gabriel Novas Domínguez,
  • William Neves Dias,
  • Jawad Masood,
  • Santiago Muíños Landín

摘要

This research presents a novel approach to automating the disassembly process of personal computers (PCs) as a critical step toward circular manufacturing of Waste Electrical and Electronic Equipment (WEEE). By integrating artificial intelligence (AI) and robotics, we aim to optimize resource recovery and minimize environmental impact. The study focuses on developing a system that accurately identifies and localizes key PC components, such as motherboards, processors, cooling fans, and screws, using modern computer vision techniques. YOLO object detection algorithm is employed for 2D image analysis, while morphological computer vision is utilized to transform 2D coordinates into 3D locations. A collaborative robot is then tasked with unmounting the identified components based on the generated 3D locations. This research contributes to the Horizon Europe’s Circular TwAIn project by demonstrating the potential of AI and robotics to revolutionize WEEE management and promote a more sustainable electronic waste lifecycle in Europe.