Transfer moulding is a crucial process in the assembly of electronic plastic packages. In transfer moulding process, epoxy moulding compounds (EMC) are used to encapsulate the chip and wire collar attached to the leadframe, protecting the chip inside the package. The most common defect that occurs during moulding is the formation of voids. Voids can cause oxidation of the moulding compound due to trapped air, affecting the product's reliability. By optimizing the process parameters, voids can be minimized, thereby extending the product's lifespan. The methodology of this project involves analyzing images of voids in the package. The first step involves capturing an image of the packaging using an X-ray machine. The X-ray image is then transferred to a computer to determine the void area. CATIA software is used to measure the total area of the voids. The Taguchi method is applied to identify the optimal combination of process parameters. Four parameters were selected for optimization: clamping force, curing time, transferring pressure, and transferring speed. The results indicate that transferring speed is the most significant parameter, with an impact of 88.34%. An increase in transferring speed leads to a significant reduction in the total area of the voids. The optimization process showed that the number of voids could be reduced by up to 80%. This demonstrates that using the Taguchi method can significantly reduce the voids during injection moulding, thereby improving the quality of electronic plastic packaging.