Electrochemical discharge machining (ECDM) is the modern non-conventional method for machining conductive and non-conductive materials such as silicon, glass, ceramics, composites, quartz, polymer. In the ECDM process, there are various input parameters like pulse duration, duty cycle, applied voltage, electrolyte concentration, gas film formation, different types of electrolytes, etc. affect the performance of the machined surface. In this research paper, an experimental study on silicon wafer material is done by the ECDM process. By varying the applied voltage and tool feed rate (TFR), an effort was made to make a microhole on the silicon wafer. The experimental study has shown that a microhole has been made on the surface of the material at a voltage of 60 V. At a constant tool feed rate of 115 µm/min and an electrolyte concentration of 20wt%/vol, the experimental results in case 1 showed that MRR and radial overcut increase as the applied voltage increases. The material removal rate (MRR) and radial overcut both fall when the tool feed rate rises in Case 2, which has a fixed electrolyte concentration of 20wt%/vol and a voltage of 62.5 V.