This study investigates the medium-pressure plasma processing of SiO2, exploring its potential applications across various fields. Fused silica, renowned for its exceptional optical, mechanical, and thermal properties, holds significant promise in advanced manufacturing sectors, i.e., optics, aerospace, defense, and electronics industries. Medium-pressure plasma processing emerges as a versatile technique capable of modifying fused silica’s surface properties with precision and better efficiency. MPPP is designed and fabricated to provide ultra-smooth components for optical materials without causing subsurface damage. It is basically a chemical interaction between active radicals and workpiece atoms, preventing subsurface damage and allowing for atomic-level precision machining. MPPP has shown the ability to accomplish a high removal rate while causing no subsurface damage to the optical surface’s silica-based substance. The morphological image, chemical composition, topography, and quantitative Ra value are analyzed in depth prior to and post-MPPP. The results depict that etched pits merge and convert into uneven concave-convex structures with marginally increased surface roughness (Ra) without any surface contamination. Furthermore, the elemental composition demonstrates the fluorine atoms present on the substrate after the plasma process, which results in the reactions that occur during plasma processing. Moreover, the implications of the plasma process and its practical applications are also discussed.