This study focuses on the design and temperature analysis of a Thin Film Bulk Acoustic Resonator (FBAR) operating at a frequency of 2.4 GHz. The FBAR is a type of resonator that utilizes thin film technology to achieve its functionality. This study aimed to optimize the design of the FBAR resonator and assess its performance under different temperature conditions. The resonator is designed to operate at the specific frequency of 2.4 GHz, which is commonly used in various wireless communication systems, including Wi-Fi and Bluetooth. The reliability in terms of temperature is observed by keeping the device in temperature chamber at different temperature ranges for longer hours and see the effect of temperature on the performance of the device in terms of its S parameters. The FBAR is designed in Comsol multiphysics and frequency analysis is done at 2.4 GHz. The quality factor obtained is 2585.