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This paper investigates the mechanical properties of ceramic matrix composites and GH4169 bolted single lap structures under high-temperature conditions. The permissible range of pretension force applicable to the CMC-metal connection structure is established through static compression experiments. By employing quasi-static tensile simulations and accounting for the relaxation behavior of bolt preload at elevated temperatures, a sleeve structure is introduced to enhance connection performance. The impact of this sleeve structure on preload stability, load capacity enhancement, and damage evolution in metal-composite bolted connections at high temperatures was analyzed using finite element methods. The findings indicate that the sleeve structure significantly improves preload effectiveness in high-temperature environments, minimizes gaps between connectors, and substantially mitigates thermal stress concentration phenomena, thereby enhancing the overall performance and reliability of the connection system.

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Optimization of Mechanical Properties for CMC-Metal Bolted Connections at High Temperature

  • 章节

  • 发表日期：

    2026年

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  • Lu Zhang,
  • Xianqing Chen,
  • Hailang Ge,
  • Xiguang Gao,
  • Yingdong Song

摘要

This paper investigates the mechanical properties of ceramic matrix composites and GH4169 bolted single lap structures under high-temperature conditions. The permissible range of pretension force applicable to the CMC-metal connection structure is established through static compression experiments. By employing quasi-static tensile simulations and accounting for the relaxation behavior of bolt preload at elevated temperatures, a sleeve structure is introduced to enhance connection performance. The impact of this sleeve structure on preload stability, load capacity enhancement, and damage evolution in metal-composite bolted connections at high temperatures was analyzed using finite element methods. The findings indicate that the sleeve structure significantly improves preload effectiveness in high-temperature environments, minimizes gaps between connectors, and substantially mitigates thermal stress concentration phenomena, thereby enhancing the overall performance and reliability of the connection system.