Microstructure fabrication employs standard equipment apart from machining tools such as DRIE, wafer bonder, KOH bath, VHF tool. The process steps are having similarity with the standard IC fabrication process. The various individual process steps and its integration aspects are looked very critically as per the specifications. Apart from metrological tools, wafer characterization also to be carried out and the reliability aspects to be examined for the application. Wafer encounters various process which demands multiple times processing from the same equipment for deposition or etching. Microstructure fabrication process is similar to the integrated fabrication and the main process difference relates with the micromachining process. Main process steps are metallization, deposition, lithography, and etching, bulk machining which can be either using dry or wet techniques.