Research on Pinhole Defects in the Screen Priting Ink Layer on the Surface of Metal Plate
摘要
In superplastic forming/diffusion connection (SPF/DB) technology, the preparation of isolated welding pattern is very important to the welding quality. In this paper, the formation causes and reduce methods of pinholes in screen printing ink layer were studied, and the effects of different ink fineness, plasticizer addition, solvent type, vacuum degassing treatment and other factors on the number and size of pinholes were tested. It is found that the dispersion fineness of ink has the greatest influence on the number and size of pinholes in ink layer. The smaller the fineness, the smaller the number and size of pinholes in ink layer. Vacuum degassing can significantly reduce the number of pinholes in the ink layer. The use of mixed solvent has little effect on the pinholes of the ink layer. The pinhole quality control standards is proposed as follows: Pinholes larger than 150 μm should be strict restricted. Pinholes with the size of 50–100 μm, the number of pinholes must be less than 20/cm2. Pinholes smaller than 50 μm are allowed.