Scholarlink

In this chapter, the recent advances and trends in Cu–Cu bumpless hybrid bonding technology for chiplets and heterogeneous integration are presented. Emphasis is placed on the design, materials, process, fabrication, reliability, advantages, disadvantages, and examples of Cu–Cu bumpless hybrid bonding from various companies such as Sony, CEA-Leti, Samsung, imec, Brewer Science, EVG, Yokohama National University, University of Tsukuba, SUSS MicroTec, Micron, Intel, Washington State University, Arizona State University, Applied Materials, National Yang Ming Chiao Tung University, Synopsys Inc., BE Semiconductor Industries, EVG, TSMC, AMD, ASE, Tokyo Electron America, Fraunhofer IZM, AIST, Okamoto Machine Tool Works, SUNY Binghamton, IBM Research, Daicel, Mitsui, Industrial Technology Research Institute, Nanya Technology Corp., Brewer Science, Tsinghua University, and Semiconductor Technology Innovation Center. Also, some recommendations will be provided.

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Recent Advances and Outlooks in Hybrid Bonding

  • 章节

  • 发表日期：

    2025年

查看全文
  • John Lau,
  • Xuejun Fan

摘要

In this chapter, the recent advances and trends in Cu–Cu bumpless hybrid bonding technology for chiplets and heterogeneous integration are presented. Emphasis is placed on the design, materials, process, fabrication, reliability, advantages, disadvantages, and examples of Cu–Cu bumpless hybrid bonding from various companies such as Sony, CEA-Leti, Samsung, imec, Brewer Science, EVG, Yokohama National University, University of Tsukuba, SUSS MicroTec, Micron, Intel, Washington State University, Arizona State University, Applied Materials, National Yang Ming Chiao Tung University, Synopsys Inc., BE Semiconductor Industries, EVG, TSMC, AMD, ASE, Tokyo Electron America, Fraunhofer IZM, AIST, Okamoto Machine Tool Works, SUNY Binghamton, IBM Research, Daicel, Mitsui, Industrial Technology Research Institute, Nanya Technology Corp., Brewer Science, Tsinghua University, and Semiconductor Technology Innovation Center. Also, some recommendations will be provided.