The aggressive liquefaction process that takes place at the cathode tip on electrical stressing of chromium (Cr) films, deposited on electrically insulating substrates, is at the heart of a subtractive scanning probe lithography technique known as electrolithography (ELG). Conventionally the electric field stress applied on the Cr film is in the lateral direction. Impedance spectroscopy of the liquefied region has revealed it to be highly resistive. This can affect the net resistance of the electrical circuit as well as lead to local reorganization of the electric field spread, which can eventually lead to reliability concerns during large-area patterning using the ELG technique. Thereby, to mitigate such potential reliability concerns, we apply a transverse electric field to perform the electro-liquefaction process of Cr, which was made possible by utilizing a non-insulating substrate underneath the Cr layer. Despite the change in the electric field direction, we find that the electro-liquefaction process of Cr remains aggressive. The results discussed in this study will thereby help in developing a robust and reliable ELG patterning technique.