Through ultrasonic dispersed graphite suspension, the graphite is evenly dispersed among the copper powder particles by magnetic stirring and high-energy ball grinding. The Graphite/copper composite material exhibits excellent comprehensive performance, prepared by discharge plasma (SPS) sintering. Utilizing techniques such as optical microscopy (OM), scanning electron microscope (SEM), X-ray diffraction instrument (XRD), hardness instrument and conductivity instrument. The results show that: 1.0wt.%C/Cu composite powder in the early stage of the ball grinding powder size is 27.9um, largely, increasing ball grinding time, the microstructure and particle size of graphite-enhanced copper base composite change significantly. When the ball grinding time is 8 h, the copper grains are uniform and fine, with an average grain size of 10.7 um. The graphite particles are broken and gradually dispersed evenly distributed between copper particles or adhering to the surface of the copper particles. When the sintering temperature increases from 700℃ to 750℃, the relative density, Vickers hardness and conductivity of Graphite/copper composites increased by 2.92%, 3.90% and 4.81%, respectively. However, when the sintering temperature increases from 750℃ to 900℃, the relative density, Vickers hardness and conductivity all decrease. When the sintering temperature is 750℃, the Graphite/ copper composite tissue is uniformly dense with an average grain size of about 9.1um. The relative density is 98.78%, the Vickers hardness is 63.9HV0.5, and the conductivity is 89.4% IACS, indicating better comprehensive mechanical performance.