A Computational Study on the Impact of AgNP Nanocoating Thickness on Heat Sink Dissipation Capacity Inside Electronic Packaging
摘要
Nanoparticles (NP) with sizes ranging from 1 to 100 nm give high surface area properties and have a high potential to improve the thermal performance of the heat sink. Good heat-conducting metals, such as silver (Ag) and gold (Au), are rarely used in heat sinks due to their high cost. With nanocoating techniques, only a small amount of Ag or Au is needed to coat a layer on the heat sink, and the cost can be reduced. In this paper, the application of AgNP coating onto a heat sink is modelled to predict the heat dissipation performance of the heat sink. The performance of the heat sink with AgNP coating under natural convection is modeled using the ANSYS FLUENT software. The simulation result is verified by other researchers with the experimental findings. A parametric study on the effect of AgNP coating thickness is conducted by using a nanocoating thickness of 10–500 µm. The presence of the AgNP coating promotes heat dissipation of the heat sink but reduces when the thickness increases.