Solution Hardening Effect of Bi Additions to the β-In3Sn Phase in In-Sn-Bi Low Temperature Solder Alloys via Alloy Design and Heat Treatment
摘要
The binary In-Sn low temperature solder alloys with a majority of β In-rich phase in the microstructure exhibit exceptional electrical conductivity and ductility. However, at room temperature or above, they require higher strength to match the performance of common solder alloys. This study investigates the potential of Bi to be used as an alloying addition to optimise the strength of a single phase β-In3Sn alloy through solution hardening. The alloy selected, based on microstructural design using CALPHAD methods, was In-13wt%Sn-13wt%Bi which is characterised by a 100% β-In3Sn(Bi) phase being present in the microstructure above 55 ℃. The microstructure was examined using scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) spectrum analysis before and after annealing. The mechanical properties of the alloy before and after annealing were characterised using Vicker’s hardness and compared with the hardness of In-30wt%Sn and In-25wt%Sn binary alloys.