The increasing demand for high-precision parts has significantly grown within the past decades. Precision grinding, as one of the most widely utilized abrasive machining techniques in precision machining, provides reliable method to achieve the deterministic precision requirements of the high quality and functional parts in optical, semiconductor, automobile, and medical device industry. Precision grinding involves the use of abrasive tools to removal material from a workpiece to achieve high dimension accuracy and surface finish. It employs grinding wheels as regular tools, which are embedded with abrasive grains to act and grind down the surfaces of parts. The precision aspect refers to achieving a relatively higher tolerances and fine surface finishes and pushing the machining accuracy limit to micron and submicron levels. This chapter begins by introducing the fundamentals of the grinding process, including a detailed explanation of the abrasive grains, bonding systems, and grinding tools. Additionally, the design and dressing techniques of precision grinding tools are explored. Following this, the process parameters, such as depth of cut, material removal rate, force, and temperature, are discussed in detail. Given the critical role of material removal mechanisms in determining machining capabilities and accuracy limits, this chapter also delves into the distinct material removal processes for ductile and brittle materials. Finally, the chapter highlights the application of precision grinding in producing optical lenses and semiconductor wafers, showcasing its essential role in modern manufacturing.