Scholarlink

This study introduces a low-temperature co-fired ceramic (LTCC) packaging structure for D-band LNA chips and an LTCC antenna implemented based on this structure. The LTCC packaging structure includes a dielectric waveguide composed of via arrays, probes made of metal patches and bonding wires, and an electromagnetic bandgap (EBG) structure laid to suppress resonance. By adjusting the dimensions of the bonding wires and metal patches, the signal transmission performance from GSG to the dielectric waveguide can be effectively improved. The LTCC antenna incorporates a variable resistor filter and an LTCC horn structure at the dielectric waveguide. Through theoretical analysis and full-wave simulations, this paper explains the working principles of the LTCC packaging and antenna, along with their design processes. Simulation results show that the LTCC packaging achieves an average insertion loss below 0.5dB and return loss better than 15dB in the D-band, while the LTCC antenna demonstrates a return loss below 10dB with an average gain of 9.45dBi in the same band. This study proves the feasibility of applying this technology to advanced wireless systems in the D-band.

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

D-band LNA Chip Packaging Technology Based on LTCC Process

  • 会议论文

  • 发表日期：

    2026年

查看全文
  • Mingze Li,
  • Guoqing Huang,
  • Gang Gao,
  • Ziqiao Zhou,
  • Liu Hao,
  • Weihua Yu

摘要

This study introduces a low-temperature co-fired ceramic (LTCC) packaging structure for D-band LNA chips and an LTCC antenna implemented based on this structure. The LTCC packaging structure includes a dielectric waveguide composed of via arrays, probes made of metal patches and bonding wires, and an electromagnetic bandgap (EBG) structure laid to suppress resonance. By adjusting the dimensions of the bonding wires and metal patches, the signal transmission performance from GSG to the dielectric waveguide can be effectively improved. The LTCC antenna incorporates a variable resistor filter and an LTCC horn structure at the dielectric waveguide. Through theoretical analysis and full-wave simulations, this paper explains the working principles of the LTCC packaging and antenna, along with their design processes. Simulation results show that the LTCC packaging achieves an average insertion loss below 0.5dB and return loss better than 15dB in the D-band, while the LTCC antenna demonstrates a return loss below 10dB with an average gain of 9.45dBi in the same band. This study proves the feasibility of applying this technology to advanced wireless systems in the D-band.