This study employs molecular dynamics simulations to analyze and compare the structures of traditional bisphenol a epoxy resins and cycloaliphatic epoxy resins, demonstrating the feasibility of using cycloaliphatic epoxy resins in blending to enhance the electrical and thermal properties of traditional bisphenol A-based resins. Subsequently, six epoxy resin materials with different base resin ratios were prepared, and their glass transition temperatures and dielectric properties were tested to identify the optimal base resin ratio. The results indicate that when both glass transition temperatures reach high values, the cured resin mixture with an 8:2 mass ratio of bisphenol a epoxy resin to cycloaliphatic epoxy resin achieves the highest dielectric strength, exceeding the performance of pure bisphenol A resin systems by over 20%. This demonstrates the scientific validity and effectiveness of blending technology in improving epoxy resin electrical and thermal properties, providing theoretical and experimental foundations for developing epoxy resins with superior performance.