Bioinspired dry adhesive surfaces have demonstrated promising application potential due to their controllable adhesion characteristics. However, in practical applications, the adhesive mechanical behavior of microstructure arrays is significantly influenced by complex factors including inter-unit elastic coupling, backing layer thickness, height difference of micropillars, surface roughness and oblique contact. These factors collectively lead to pronounced non-uniform distribution of adhesive loads among individual units, posing significant challenges for dynamic adhesion mechanics modeling of microstructure arrays. This study focuses on macroscopic array configurations composed of mushroom-shaped micropillars with superior adhesion properties. An empirical formula for the adhesion prediction of microstructure arrays is developed. At the microscale, the model employs Lennard-Jones potential-controlled interaction relationships to characterize interfacial contact mechanics. At the macroscopic scale, the nonlinear spring is adopted to equivalent the mechanical properties of mushroom-shaped micropillars. The secondary development of the finite element software was realized by using python scripts, and the multi-scale finite element analysis model was successfully constructed. The influence of key parameters on the adhesive performance of microstructure arrays was systematically investigated. The results demonstrate that this simplified adhesive contact mechanical model can accurately describe the interfacial mechanical properties of the microstructure array. Furthermore, it elucidates the governing principles of how coupling factors affect the adhesive performance of microstructure arrays, providing valuable insights for the design and optimization of bioinspired adhesive surfaces.