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To address the cooling issue of IGBT (Insulated Gate Bipolar Transistor) chips in a 5-ton pure electric loader, this study experimentally measured the temperature characteristics of the existing forced convection cooling system and proposed an improved liquid cooling solution with performance testing of the cold plate. A system model was built in AMESim, converting experimental data into boundary conditions for simulation validation. Results showed a simulation error of only 2.47%, confirming model reliability. The improved solution reduced chip temperature from 72.46 °C to 66.79 °C, an 8.49% decrease. The study demonstrates that cold plate performance must be pre-measured to ensure simulation accuracy, providing a reference for optimizing IGBT cooling systems in new energy loaders.To enhance the cooling performance of IGBT chips in a 5-ton electric loader, this study tested the thermal characteristics of the original air-cooling system and proposed an improved liquid-cooling solution. The performance of the cooling plate was experimentally evaluated. Based on measured data, an AMESim model was established, with a simulation error of only 2.47%, validating the model’s reliability. The improved system reduced the chip temperature from 72.46 °C to 66.79 °C, providing a foundation for further IGBT cooling optimization.

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Analysis and Improvement on Cooling System of IGBT for New Energy Wheel Loader

  • 会议论文

  • 出版模式：

    开放获取

  • 发表日期：

    2026年

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  • Jiaxin Liu,
  • Xiang Li,
  • Wanjun Zhang,
  • Naijiang Liu,
  • Jingtao Zhao,
  • Peng Liu,
  • Martin Kreschel

摘要

To address the cooling issue of IGBT (Insulated Gate Bipolar Transistor) chips in a 5-ton pure electric loader, this study experimentally measured the temperature characteristics of the existing forced convection cooling system and proposed an improved liquid cooling solution with performance testing of the cold plate. A system model was built in AMESim, converting experimental data into boundary conditions for simulation validation. Results showed a simulation error of only 2.47%, confirming model reliability. The improved solution reduced chip temperature from 72.46 °C to 66.79 °C, an 8.49% decrease. The study demonstrates that cold plate performance must be pre-measured to ensure simulation accuracy, providing a reference for optimizing IGBT cooling systems in new energy loaders.To enhance the cooling performance of IGBT chips in a 5-ton electric loader, this study tested the thermal characteristics of the original air-cooling system and proposed an improved liquid-cooling solution. The performance of the cooling plate was experimentally evaluated. Based on measured data, an AMESim model was established, with a simulation error of only 2.47%, validating the model’s reliability. The improved system reduced the chip temperature from 72.46 °C to 66.79 °C, providing a foundation for further IGBT cooling optimization.