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There have been strong demands for lower power consumption and higher bandwidth in optical/electrical interconnects used for artificial intelligence (AI) and networks in a data center. The adoption of co-packaged optics (CPO) has been expected for both high-performance computing (HPC) driven by AI and high-bandwidth and high-speed communications networks in a data center. In this chapter, on-board optics (OBO), near package optics (NPO), and CPO will be discussed. Emphasis is placed on the trends of 3D heterogeneous integration of photonic integrated circuits (PIC), electronic integrated circuits (EIC), and application specific IC (ASIC) switch with or without bridges on various CPO substrates such as organic, silicon, and glass. Some recommendations will be provided.

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Heterogeneous Integration of PIC, EIC, and Switch (CPO)

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  • 发表日期：

    2026年

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  • John Lau,
  • Kuo-Ning Chiang

摘要

There have been strong demands for lower power consumption and higher bandwidth in optical/electrical interconnects used for artificial intelligence (AI) and networks in a data center. The adoption of co-packaged optics (CPO) has been expected for both high-performance computing (HPC) driven by AI and high-bandwidth and high-speed communications networks in a data center. In this chapter, on-board optics (OBO), near package optics (NPO), and CPO will be discussed. Emphasis is placed on the trends of 3D heterogeneous integration of photonic integrated circuits (PIC), electronic integrated circuits (EIC), and application specific IC (ASIC) switch with or without bridges on various CPO substrates such as organic, silicon, and glass. Some recommendations will be provided.