A good quality wire bond is crucial to ensure electrically connected and a high strength upon thermal and mechanical loading. However, it is a challenge to create a great bonding due to the improper parameterization set up which led to weak bond or also known as Non-Stick on Pad (NSOP), especially when trial-and-error approach that is more widely applied in semiconductor industry. Three different types of materials are assigned as following; structural steel, aluminum bronze, and CFRP and three different thickness of lead frame of 500 μm, 600 μm, and 700 μm are set as manipulating variables, meanwhile the gap beneath the lead frame will be observed and evaluated. ANSYS Mechanical Workbench is utilized to complement a trend parametrization with an aim of achieving an ideal gap of 0 μm. As a setup in ANSYS Workbench, there are two mold lock clamps force downward onto mold lock of lead frame. The thermal analysis is set to a curing temperature of epoxy die attach (300 °C). The validation is conducted by comparing the gap of Trend Parameterization with the previously approved wire bonding. The validated result proves that increment of toughness and lead frame thickness are greatly risky for NSOP which is potential in the wire bonding clamping process and can gradually eliminate culture of trial-and-error as well as saving time, effort and energy.