The Effect of Heat Sinks on the Surface Temperature of Thin-Film Heat Flux Sensors
摘要
A TFHFS featuring a heat sink structure was both designed and manufactured using magnetron sputtering. Simulation software optimized the sensor’s parameters, and the final design was validated through experimental comparison. The sensor with the heat sink exhibited a higher temperature difference, output voltage, and thermal conductivity, consistent with simulation results. It showed a linear relationship between output voltage and heat flux density. The sensitivity was measured at 0.03723 mV/(kW/m2).