This study utilizes COMSOL Multiphysics software to establish a steady-state simulation model of an SF6 circuit breaker based on the laminar flow interface and solid heat transfer interface. The model analyzes the heat transfer characteristics inside the SF6 circuit breaker, focusing on the distribution and influencing factors of convective heat flux between the SF6 gas and solid surfaces. The simulation model accurately describes the coupling effect of fluid flow and heat transfer inside the circuit breaker. By solving the fluid flow and solid heat transfer modules step-by-step, key data such as fluid temperature distribution, velocity field, and solid surface temperature distribution are obtained. The results show that fluid velocity and temperature gradient significantly affect convective heat flux. Areas with higher fluid velocity exhibit more efficient heat transfer, while hotspot regions with larger temperature gradients require special attention to prevent equipment overheating. This study provides a theoretical basis for optimizing the thermal management of SF6 circuit breakers. Future research could expand the simulation model and increase the coupling of physical fields to further improve analysis accuracy and optimize equipment performance and reliability.