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Integrated circuit (IC) packaging protects internal chips and provides mechanical support, electrical connections and heat dissipation. The characteristics of physical properties and reliability of IC packaging materials and structures mainly involve aspects such as electrical performance, thermal properties, mechanical characteristics, hygroscopicity or hermeticity and environmental adaptability.

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Physical Properties and Reliability Characteristics of Integrated Circuit Packaging

  • 章节

  • 发表日期：

    2026年

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  • Bin Zhou,
  • Yunfei En,
  • Si Chen

摘要

Integrated circuit (IC) packaging protects internal chips and provides mechanical support, electrical connections and heat dissipation. The characteristics of physical properties and reliability of IC packaging materials and structures mainly involve aspects such as electrical performance, thermal properties, mechanical characteristics, hygroscopicity or hermeticity and environmental adaptability.