Integrated Circuit (IC) consists of internal chips with specific functions and external packages that support and protect these chips. Tummala (Fundamentals of microsystems packaging. McGraw-Hill Education, 2000 [1]) from the Georgia Institute of Technology defines IC packaging as the process of mounting functional IC chips into appropriate carriers using various methods, which provides a stable and reliable operating environment for the chips, effectively dissipates the heat generated by the internal chips to the outside, and ensures the proper functionality of the IC. Packaging, as an essential component of an integrated circuit, serves as the bridge for electrical connections between the internal chip and the external environment. It also secures, seals, and protects the chip while ensuring its thermal, electrical, mechanical performance, and reliability.