The development of Micro-Electro-Mechanical Systems (MEMS) has transformed sensor technology, leading to the creation of highly precise sensors at microscale dimensions for modern measurement capabilities. Among MEMS devices, micro-cantilevers have gained prominence due to their versatile functionality, compact design, and potential for integration into a variety of sensing platforms. This proposed work highlights the design and fabrication of silicon cantilevers along with Micro-tips using MEMS technology. It offers enhanced performance over conventional bonded-tip designs by eliminating alignment errors and ensuring mechanical robustness. Silicon is chosen as a structural material for both cantilevers and micro-tips due to its high Young’s modulus and compatibility with MEMS fabrication techniques. These cantilevers with integrated tips have a wide range of applications, including nanometer-resolution surface profiling (e.g., Atomic force microscopy) and Nano indenter calibration, with the capability to achieve sub-nanometer displacement resolution. The piezo resistors can also be embedded on top of cantilevers to use them as a position sensor, which converts the cantilever deflection into an electrical signal. The designed sensors are simulated using the Covent or Ware tool to analyses the mechanical behavior of the silicon cantilever beam as well as to finalize the fabrication flow of the proposed device.