The long-time exposure of electronic devices to elevated temperature is the main cause of its decreased longevity. In order to maintain temperature within a safe limit, heat has to be dissipated at the rate equal to or greater than the rate at which it is generated. Heat pipe being a superior thermal conductor is a great choice for the thermal management of electronic devices. A heat sink with PCM (Phase Change Material) enhanced heat pipe is designed and developed for thermal management of electronic devices. Presence of n-eicosane (PCM) at the evaporator region or adiabatic region will prevent the heat pipe from getting overheated owing to its high heat capacity. Even though the location of application of PCM on heat pipe is insignificant in lower heat inputs, heat pipe performs better when PCM is applied at the evaporator region. At 10 W heat input, the evaporator temperature is 10.5 ℃ lower when PCM is applied at the evaporator region than that applied at the adiabatic region.