Thermal Cure Coupling Optimization Analysis of Integrated Thermal Protection System Connector
摘要
This study focuses on the heat conduction characteristics and stress distribution patterns of the Z-shaped connecting bracket in thermal protection structures. A two-dimensional heat conduction model is established, considering the thermal radiation interaction between the outer panel and the external environment. By simulating heat conduction under different insulation layer thicknesses, the relationship between the maximum temperature of the base panel and insulation layer thickness is revealed. The model’s accuracy is verified through comparisons with a three-dimensional model and actual temperature data. Furthermore, a 1/8 scale model of the thermal protection structure is established to analyze the impact of pressure loads on bracket stress, identifying the main causes of high-stress areas. The temperature gradient in the structure’s thickness direction is found to be a key factor causing higher stress on the bracket. This research proposes a novel numerical approach for the design and optimization of thermal protection structures in aerospace vehicles.