Accelerated Folding Reliability Bending Test of Foldable Organic Light-Emitting Diode Module Based on Modified Generalized Eyring Model
摘要
With the development of display technology, foldable organic light-emitting diode (OLED) has been used extensively in the smartphone market. Panel makers have made collective efforts and gradually increased their global market share by solving reliability-related problems. In this study, the bending failure mechanism of foldable OLED modules was investigated to demonstrate the accelerating effect of temperature and humidity on bending failure. Using Weibull distribution, the modified generalized Eyring model was used to test reliability and durability and evaluate the accuracy of the results. The test method was developed to quickly and accurately predict the reliability and durability of foldable OLED modules in a short period to solve the problem of the long cycle time of the test.