This paper explores the impact of a void at material interfaces under tensile stress in two dimensions. The mismatch in material properties can create a stress singularity at the interface corner, leading to a crack or delamination. In a defective material with a tiny void, the void along the interface also contributes to this failure. Cracks tend to initiate and propagate from the void. This research employs the finite element method to analyze a bi-material joint. The finite element analysis with varying thicknesses is conducted to determine the stress distribution around the void. The findings reveal that the void introduces singularity fields, and the singularity stress decreases as the thickness increases.

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Analysis of Stress Singularities Induced by a Void at Bi-material Interfaces Under Tensile Loading Using FEM

  • Kentaro Ishibashi,
  • Attaporn Wisessint

摘要

This paper explores the impact of a void at material interfaces under tensile stress in two dimensions. The mismatch in material properties can create a stress singularity at the interface corner, leading to a crack or delamination. In a defective material with a tiny void, the void along the interface also contributes to this failure. Cracks tend to initiate and propagate from the void. This research employs the finite element method to analyze a bi-material joint. The finite element analysis with varying thicknesses is conducted to determine the stress distribution around the void. The findings reveal that the void introduces singularity fields, and the singularity stress decreases as the thickness increases.