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This study investigates the thermal management of a double-sided cooled (DSC) silicon carbide (SiC) power module, comparing its performance with traditional direct bonded copper (DBC) packaging. A full-bridge SiC module integrated with a vertical liquid-cooling system is developed, leveraging the superior thermal conductivity and compactness of DSC design. A finite element model (FEM) is established to analyze the module’s thermal and electrical characteristics, incorporating conductive heat transfer and turbulent flow dynamics. The simulation derives the frequency-domain thermal impedance and parasitic parameters, critical for high-frequency switching applications. Results demonstrate that the DSC structure reduces thermal resistance compared to DBC and the correlation between chip junction temperature and coolant flow velocity. The simulation result validates DSC as a promising solution for next-generation high-power-density converters.

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Design of a Full-Bridge SiC MOSFET Double-Sided Liquid-Cooled Module and Analysis of Cooling Flow Rate Effects on Thermal Performance

  • 会议论文

  • 发表日期：

    2026年

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  • Guanting Lou,
  • Guangyao Ying,
  • Zhi Li,
  • Jing Li,
  • Kai Yin

摘要

This study investigates the thermal management of a double-sided cooled (DSC) silicon carbide (SiC) power module, comparing its performance with traditional direct bonded copper (DBC) packaging. A full-bridge SiC module integrated with a vertical liquid-cooling system is developed, leveraging the superior thermal conductivity and compactness of DSC design. A finite element model (FEM) is established to analyze the module’s thermal and electrical characteristics, incorporating conductive heat transfer and turbulent flow dynamics. The simulation derives the frequency-domain thermal impedance and parasitic parameters, critical for high-frequency switching applications. Results demonstrate that the DSC structure reduces thermal resistance compared to DBC and the correlation between chip junction temperature and coolant flow velocity. The simulation result validates DSC as a promising solution for next-generation high-power-density converters.