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Epoxy resins are widely used in high-voltage electrical equipment such as generators, transformers, bowl-shaped insulators, and others, undertaking the essential roles of electrical insulation, thermal conductivity, and mechanical reinforcement. Understanding the failure mechanisms of epoxy resins at the molecular scale under different stress conditions is of great significance for ensuring the safe and stable operation of electrical equipment. Molecular dynamics simulations were conducted to reveal the underlying failure mechanisms of a DGEBA/DETA epoxy system in the paper, demonstrating the temperature-dependent molecular evolution under mechanical and thermal stresses. The results show that in the oligomeric state (under the condition of one-end cross-linking), the mechanical failure of epoxy resin is mainly caused by molecular chain slippage due to low viscosity, resulting in its failure under large strain. Under high-temperature conditions (>700 K), the system will rapidly expand due to pressure instability, leading to system failure. This study serves as a certain foundation for guiding the design of insulating materials in the future.

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Molecular Dynamics Investigation of the Mechanical and Thermal Failure Behaviors in Cross-Linked DGEBA/DETA Epoxy Networks

  • 会议论文

  • 发表日期：

    2026年

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  • Yu-Xiao Liu,
  • Zhang Yue,
  • Huang Zhou,
  • Shao-Long Zhong,
  • Zhi-Min Dang

摘要

Epoxy resins are widely used in high-voltage electrical equipment such as generators, transformers, bowl-shaped insulators, and others, undertaking the essential roles of electrical insulation, thermal conductivity, and mechanical reinforcement. Understanding the failure mechanisms of epoxy resins at the molecular scale under different stress conditions is of great significance for ensuring the safe and stable operation of electrical equipment. Molecular dynamics simulations were conducted to reveal the underlying failure mechanisms of a DGEBA/DETA epoxy system in the paper, demonstrating the temperature-dependent molecular evolution under mechanical and thermal stresses. The results show that in the oligomeric state (under the condition of one-end cross-linking), the mechanical failure of epoxy resin is mainly caused by molecular chain slippage due to low viscosity, resulting in its failure under large strain. Under high-temperature conditions (>700 K), the system will rapidly expand due to pressure instability, leading to system failure. This study serves as a certain foundation for guiding the design of insulating materials in the future.