As a key elastic contact element in high-voltage electrical equipment, the electro-thermal multi-physical field coupling performance of spring-clip contact directly affects the reliability and temperature rise characteristics of the equipment. In view of the insufficiency of multi-field coupling analysis in the existing research, this paper adopts the finite element simulation method, establishes the three-dimensional electro-thermal coupling model of spring-clip contact, and systematically researches its contact temperature rise, current density distribution and structural parameter influences. The results show that: the contraction effect of the current line at the contact point of the spring-clip contact leads to the highest local temperature rise (up to 48.5 K), and the current density distribution shows obvious non-uniformity (the peak value reaches 21.71 MA/m2); the changes of the number of contact finger turns, spring inclination angle and groove angle have significant effects on the contact resistance, temperature rise and current density, of which the number of turns 125, inclination angle 150° are the better parameters to optimize the electrical and thermal performance. This study provides a theoretical basis for the optimization of the structure of spring-clip contacts and the reliability assessment of high-voltage equipment.

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Study on the Electrical Contact Performance of Spring-Loaded Contact Fingers Under Multi-physical Field Coupling Effects

  • Qianhua Wu,
  • Hao Yang,
  • Miaomiao Chen,
  • Chenlei Wu,
  • Zichen Zhang

摘要

As a key elastic contact element in high-voltage electrical equipment, the electro-thermal multi-physical field coupling performance of spring-clip contact directly affects the reliability and temperature rise characteristics of the equipment. In view of the insufficiency of multi-field coupling analysis in the existing research, this paper adopts the finite element simulation method, establishes the three-dimensional electro-thermal coupling model of spring-clip contact, and systematically researches its contact temperature rise, current density distribution and structural parameter influences. The results show that: the contraction effect of the current line at the contact point of the spring-clip contact leads to the highest local temperature rise (up to 48.5 K), and the current density distribution shows obvious non-uniformity (the peak value reaches 21.71 MA/m2); the changes of the number of contact finger turns, spring inclination angle and groove angle have significant effects on the contact resistance, temperature rise and current density, of which the number of turns 125, inclination angle 150° are the better parameters to optimize the electrical and thermal performance. This study provides a theoretical basis for the optimization of the structure of spring-clip contacts and the reliability assessment of high-voltage equipment.