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This chapter delves into the formulation and deposition strategies employed for both baseline and hybrid conductive inks, which are essential in advancing flexible and printed electronics. The chapter begins with a detailed exploration of the preparation methodologies for two distinct conductive ink systems. The baseline ink, formulated with graphene nanoplatelet (GNP), epoxy resin, and polyetheramine, serves as a reference point for evaluating fundamental electrical, mechanical, and adhesive properties. In contrast, the hybrid ink integrates a combination of GNPs, silver (Ag), and zinc (Z), with ethanol, 1-butanol, and terpineol functioning as solvents and binders. This hybrid system is purposefully designed to enhance conductivity, particle connectivity, and mechanical resilience, addressing some of the limitations commonly associated with single filler inks.

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Formulation and Deposition Techniques for Baseline/Hybrid Conductive Hybrid Inks

  • 章节

  • 发表日期：

    2026年

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  • Mohd Azli Salim,
  • Nor Azmmi Masripan,
  • Norida Mohammad Noor

摘要

This chapter delves into the formulation and deposition strategies employed for both baseline and hybrid conductive inks, which are essential in advancing flexible and printed electronics. The chapter begins with a detailed exploration of the preparation methodologies for two distinct conductive ink systems. The baseline ink, formulated with graphene nanoplatelet (GNP), epoxy resin, and polyetheramine, serves as a reference point for evaluating fundamental electrical, mechanical, and adhesive properties. In contrast, the hybrid ink integrates a combination of GNPs, silver (Ag), and zinc (Z), with ethanol, 1-butanol, and terpineol functioning as solvents and binders. This hybrid system is purposefully designed to enhance conductivity, particle connectivity, and mechanical resilience, addressing some of the limitations commonly associated with single filler inks.