Adhesion, curing, and mechanical behaviour are fundamental aspects that define the performance and reliability of conductive inks in printed electronics. Conductive inks, increasingly employed in flexible, wearable, and next generation electronic devices, must form stable and durable interfaces with substrates while maintaining continuous electrical pathways. Adhesion strength is particularly critical, as inadequate bonding can lead to delamination, micro cracking, and increased electrical resistivity, ultimately compromising device functionality. The interaction between ink formulation and substrate surface properties, including roughness, porosity, and chemical compatibility, plays a decisive role in establishing strong interfacial adhesion. Optimising these interactions requires a detailed understanding of both mechanical and chemical factors that influence the ink substrate interface.