Parallel HTRB Monitoring for Accelerated Screening of Power Device Encapsulants
摘要
This work presents a custom High Temperature Reverse Bias (HTRB) platform designed for accelerated screening of encapsulation mold compounds in power devices. The system enables parallel testing with real-time leakage current monitoring and in-situ reverse I–V acquisition under controlled temperature and humidity, allowing early detection of thermal runaway. The platform was validated on commercial 1.2 kV diodes encapsulated with two different compounds. Results show that low sodium ion concentration is more critical for long-term reliability than a high glass transition temperature. The setup can serve as a preliminary screening tool to guide compound selection before conducting time-intensive 1000-h qualification HTRB.