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This study addresses the limitations of conventional BGA (Ball grid array) solder ball placement processes—including low efficiency, structural complexity, and excessive reliance on templates—by proposing a piezoelectric jetting method based on the water-hammer effect for high-frequency solder bump formation. We comprehensively analyze the mechanism of molten solder droplet ejection through water-hammer actuation, with the droplet formation process visualized via high-speed photography. An in-depth analysis elucidates the fundamental principles governing droplet generation. Through optimized trajectory planning for the three-axis motion platform, high-quality solder ball bump arrays are successfully fabricated.

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Precision High-efficiency Water-Hammer-Driven BGA Solder Ball Placement and Jetting Control Study

  • 会议论文

  • 发表日期：

    2026年

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  • Yuyao Wu,
  • Lingguan Kong,
  • Yunlong Liu,
  • Yueyu Wu,
  • Guanyang Wu,
  • Teng Xiang,
  • Yanzhen Zhang

摘要

This study addresses the limitations of conventional BGA (Ball grid array) solder ball placement processes—including low efficiency, structural complexity, and excessive reliance on templates—by proposing a piezoelectric jetting method based on the water-hammer effect for high-frequency solder bump formation. We comprehensively analyze the mechanism of molten solder droplet ejection through water-hammer actuation, with the droplet formation process visualized via high-speed photography. An in-depth analysis elucidates the fundamental principles governing droplet generation. Through optimized trajectory planning for the three-axis motion platform, high-quality solder ball bump arrays are successfully fabricated.