This paper presents the design optimization and fabrication of polysilicon microhemispherical shell resonators featuring self-aligned integrated curved electrodes, based on a novel high-aspect-ratio bulk silicon micromachining process. This process integrates the microhemispherical shell and the surrounding capacitive electrodes into a single monolithic structure in order to eliminate assembly steps and improve manufacturing consistency. The electrode structure utilizes a novel “curved silicon post” design, which provides increased sensing area and uniform capacitive gaps. Additionally, a set of key geometric parameters for the microhemispherical resonator was optimized through finite element simulation to achieve a low frequency split while maintaining a high quality factor. The process is composed of standard and mature process modules implemented using commercial equipment, demonstrating the feasibility of wafer-level fabrication of polysilicon hemispherical shell resonator gyroscopes. Meanwhile, this approach offers enhanced integrability and manufacturability for next-generation MEMS gyroscopes.