The end-of-life (EoL) management of printed circuit boards (PCBs) presents significant challenges due to their complex composition and the difficulties associated with the recycling of their diverse composing materials. While recent attention has focused on the possibility to design and manufacture sustainable PCBs, research in this area remains limited. This paper aims to address these gaps by outlining, from a technical point of view, lifecycle specifications that challenge PCBs disassembly, and provides an analysis on data and information needed across PCBs lifecycle in order to support their disassembly, therefore to support closed-loop analyses. Through this analysis, this paper seeks to promote a shift towards more responsible PCB disassembly.