Optimization of Electromagnetic Induction Heating for Adhesive Bonding—A Computational Study on Induction Bonding Process
摘要
Thermoplastic polymers containing conductive particles have the ability to absorb electromagnetic radiation and transform it into thermal energy, resulting in the melting of the surrounding polymers. This composite mixture can function as a reversible adhesive for structural bonding using the electromagnetic radiation heating technique. It allows for quick, reversible, and precise heating of the bondline to aid in structural bonding. However, the thermomechanical deterioration of the bondline caused by the difficulties in precisely controlling the induction heating process is seen as a major obstacle to the widespread use of this technique. In this work, a multiphysics model was employed to determine the optimal parameters for induction heating, including the frequency and the spacing between the induction coil and the adhesive. The adhesive used in the computational model is a composite material consisting of Acrylonitrile butadiene styrene polymer reinforced with ferromagnetic conductive nanoparticles. The computational model was experimentally validated with an error margin of less than 5 percent. The model exhibited a substantial enhancement in the heating rate with an increase in the frequency of the AC current. While the adhesive position inside the coil design has minimal influence, it has been demonstrated that placing the adhesive near the center of the coil is optimal for achieving rapid heating. Further, the multiphysics process model developed in this work can be extended to study the heating rate in other polymer reinforced conductive composites.