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Among the various threats to secure ICs, many are semi-invasive in the sense that their application requires the removal of the package to gain access to either the front or back of the target IC. Despite this stringent application requirements, little attention is paid to embedded techniques aiming at checking the package’s integrity. This paper explores the feasibility of verifying the package integrity of microcontrollers by examining their thermal dissipation capability.

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Towards Package Opening Detection at Power-up by Monitoring Thermal Dissipation

  • 会议论文

  • 发表日期：

    2026年

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  • Julien Toulemont,
  • Geoffrey Chancel,
  • Frédérick Mailly,
  • Philippe Maurine,
  • Pascal Nouet

摘要

Among the various threats to secure ICs, many are semi-invasive in the sense that their application requires the removal of the package to gain access to either the front or back of the target IC. Despite this stringent application requirements, little attention is paid to embedded techniques aiming at checking the package’s integrity. This paper explores the feasibility of verifying the package integrity of microcontrollers by examining their thermal dissipation capability.