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The importance of thermal management for electronics has been mentioned for decades. The major cause of electronic failures relevant to temperature are about 55% reported at that time [1], and others caused by vibration and humidity each contribute to around 20% of failures.

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Materials for Thermal Management in Advanced Memory Packaging

  • 章节

  • 发表日期：

    2025年

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  • Chong Leong Gan,
  • Chen Yu Huang

摘要

The importance of thermal management for electronics has been mentioned for decades. The major cause of electronic failures relevant to temperature are about 55% reported at that time [1], and others caused by vibration and humidity each contribute to around 20% of failures.