Scholarlink

In the past fewEpoxy Molding Compound (EMC) years, advanced silicon node and packaging technology are significantly driven by the growing market on artificial intelligence (AIArtificial Intelligence (AI)), ChatGPT, 5G applications, high performance computing (HPCHigh Performance Computing (HPC)), internet of thing (IoTInternet of Thing (IoT)) and electronics in autonomous vehicle. Continuous higher demand for low power, larger data storage and faster transport speed are pushing the memory key suppliers to provide the advanced packages solutions such as uMCPUniversal Flash Storage Based Multi-Chip Package (uMCP) (Universal Flash Storage Based Multi-Chip Package), NAND-Based MCPMulti-Chip Packaging (MCP) (Multiple Chip Package) and HBMHigh Bandwidth Memory (HBM)(High Bandwidth MemoryHigh Bandwidth Memory (HBM)) for high-end applications.

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Epoxy Molding Compounds in Mechanical and Thermal Stress in Packaging Reliability

  • 章节

  • 发表日期：

    2025年

查看全文
  • Chong Leong Gan,
  • Chen Yu Huang

摘要

In the past fewEpoxy Molding Compound (EMC) years, advanced silicon node and packaging technology are significantly driven by the growing market on artificial intelligence (AIArtificial Intelligence (AI)), ChatGPT, 5G applications, high performance computing (HPCHigh Performance Computing (HPC)), internet of thing (IoTInternet of Thing (IoT)) and electronics in autonomous vehicle. Continuous higher demand for low power, larger data storage and faster transport speed are pushing the memory key suppliers to provide the advanced packages solutions such as uMCPUniversal Flash Storage Based Multi-Chip Package (uMCP) (Universal Flash Storage Based Multi-Chip Package), NAND-Based MCPMulti-Chip Packaging (MCP) (Multiple Chip Package) and HBMHigh Bandwidth Memory (HBM)(High Bandwidth MemoryHigh Bandwidth Memory (HBM)) for high-end applications.