The integration of photonic devices with CMOS (Complementary Metal-Oxide-Semiconductor) fabrication techniques has revolutionized the field of Photonic Integrated Circuits (PICs) by enabling the mass production of photonic components using the same processes that have been refined for decades in the electronics industry. This compatibility with established CMOS processes has opened up new opportunities for the large-scale deployment of PICs, driving advancements in areas like optical communications, data centers, and sensing technologies. By leveraging CMOS fabrication, PICs can now be produced with the precision, scalability, and cost-effectiveness required for commercial applications. However, integrating photonics with CMOS processes presents unique challenges, such as managing material compatibility, ensuring low optical loss, and optimizing device performance in a traditionally electronic-centric environment. Breakthroughs in silicon photonics—particularly in the development of efficient waveguides, modulators, and photodetectors—have addressed many of these challenges, allowing for the seamless coexistence of photonic and electronic components on the same chip.