Photonic Integrated Circuits (PICs) are pivotal in advancing telecommunications, data centers, and many other high-tech industries. However, traditional 2D PICs face several significant challenges that limit their performance and scalability. This chapter explores the limitations of 2D PICs, focusing on issues related to integration density, interconnection length, and overall performance.

错误:搜索内容不能为空,请输入英文关键词
错误:关键词超出字数限制,请精简
高级检索

The Evolution from 2D to 3D PICs

  • Yasha Yi

摘要

Photonic Integrated Circuits (PICs) are pivotal in advancing telecommunications, data centers, and many other high-tech industries. However, traditional 2D PICs face several significant challenges that limit their performance and scalability. This chapter explores the limitations of 2D PICs, focusing on issues related to integration density, interconnection length, and overall performance.